Image shown is representative only. Exact specifications should be obtained from the product datasheet.
AMD XCZU7EV-1FBVB900E
Manufacturer
Manufacturer Product Number
XCZU7EV-1FBVB900E
Description
IC SOC CORTEX-A53 900FCBGA
Manufacturer Standard Lead Time Contact us
Detailed Description
IC SOC CORTEX-A53 900FCBGA
Datasheet View datasheet
Product Attributes
Type
Description
Manufacturer
AMD
Operating Temperature
0°C ~ 100°C (TJ)
Core Processor
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Primary Attributes
Zynq®UltraScale+™ FPGA, 504K+ Logic Cells
Supplier Device Package
900-FCBGA (31x31)
Speed
500MHz, 600MHz, 1.2GHz
Architecture
MCU, FPGA
RAM Size
256KB
Number of I/O
204
Package / Case
900-BBGA, FCBGA
Flash Size
-
Connectivity
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Peripherals
DMA, WDT
Documents & Media
Resource Type
Link
Datasheets
Environmental Information
Product Change Notices
Additional Resources
Attribute
Description
Part Number Alias
XCZU7EV-1FBVB900E
7034715
XCZU7EV-1FBVB900E-ND
Availability
Out of Stock
Updated
5/16/2026
In-Stock: 0
Packaging Quantity Unit Price Ext Price
1 82.292.000 ₫ 82.292.000 ₫
82.292.000 ₫
All prices are shown in the selected currency
Tray · Digikey
Quantity Unit Price Ext Price
1
82.292.000 ₫
82.292.000 ₫
MOQ 1 · Order multiple 1
You May Also Be Interested In
XCZU7EV-1FBVB900I
IC SOC CORTEX-A53 900FCBGA
102.883.000 ₫ AMD
For Use With
IW-G30M-C7EV-4E004G-E008G-BEA
AMD ZYNQ US+ ZU7EV MPSOC SOM
Related Products
ATS-X50310P-C1-R0
SUPERGRIP HEATSINK 31X31X17.5MM
748.000 ₫ Advanced Thermal Solutions Inc.
ATS-X50310G-C1-R0
SUPERGRIP HEATSINK 31X31X12.5MM
694.000 ₫ Advanced Thermal Solutions Inc.
ATS-X50310B-C1-R0
SUPERGRIP HEATSINK 31X31X7.5MM
642.000 ₫ Advanced Thermal Solutions Inc.